Heat Exchanger - The 3 Basic Types of Hydronic Heating Systems You Should Know

Hydronic heat exchangers or "steam" systems have been around with us since the 1800's at the dawn of the Industrial Age. Steam engines changed the world of transportation almost overnight and steam heat or hydronic heat exchanger systems did the same thing residential and commercial heating.

Almost at the same time that the first steam boilers were made power the great railroad engines, manufacturing mills and cargo ships, steam heat found its way into the home. This is not an unnatural course of events considering the amount of heat that can be put out by steam; as anyone who has ever sat for long in a moist sauna can testify to.

The Theory behind Hydronic Heating Systems
These systems are actually very simple. The most common hydronic heat exchanger consists of three main components: the boiler (the heating source), the piping array and the heat exchangers (which transfer the heat from the water into warmth for the room.)

The process goes like this: water is heated and then either turned into steam or very near to boiling and is then piped to radiators (located through-out the house) or to thermal mass floorings (which absorbs the heat and slowly releases it into the room).

The 3 types of fuel sources for a hydronic heat exchanger are electric, gas or oil-fired boilers. Boilers can be made from cast-iron, stainless steel or copper. While there are different ways that each of these boilers are constructed, each with their own advantages and disadvantages, the main idea to understand that is each boiler is basically heating a closed-water system.

This means that any chronic lost of fluid can cause a problem. This is why the type of piping array becomes critically important to the overall system.

The Three Types

As you may have guessed by now, hydronic heat exchangers are most often classified by their piping arrangements:

o One-pipe or single pipe
o Two pipe
o Loop series

The oldest of their designs is the one-pipe array. A single pipe carries steam from the boiler to every radiator in the structure. The single-pipe has a layout made so that eventually gravity will pull the condensed water in the piping back into the boiler tank. A two-pipe system uses a second return pipe instead of gravity-induced flow to bring water back to the holding tanks.

Both single and two pipe systems were designed for steam-based heat exchangers but most modern units use hot water in a loop series of pipes as the heat conductors. This type of system offers a slimmer wall-mount, stainless steel heat transfer unit and has better energy-efficient water to air heat transfer rates.

Another advantage of this kind of hydronic heating is that if properly equipped will heat water for domestic uses like cooking, washing or bathing as well as water for external uses such as swimming pools, spas, hot tubs, garages or greenhouses. Plus looped pipe hydronic heat exchangers will not only provide heat in the winter months but can be used to circulate chilled water in the summer months to aid in overall cooling.

So as you can see modern hydronic heat exchanger systems can not warm you and your family in those cold winter months but also provide a low cost method of central air cooling as well.

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Heat Exchanger Safety - A Maintained Furnace is a Safe Furnace

Heat exchangers are pieces of equipment that are used for the transfer of heat from one fluid to another. When a heat exchanger goes bad, chances are, important things stop working. When your automobile engine is overheating, it's likely that the heat exchanger is the problem. You probably call it a radiator, but it's one type of heat exchanger. In your radiator, antifreeze cools air that flows past it. This air is then blown by a fan onto the engine to keep it cool. If the radiator doesn't work properly, you won't be driving very far until the situation is fixed.

Your home heating system also has a heat exchanger. In fact, nearly every piece of mechanical equipment that has a need to intentionally heat or cool part of a system does. Inside your furnace there is a combustion chamber. There is a metal wall that separates the internal combustion from the air that flows past the heat exchanger and on through the ductwork to heat your home. You need this separation because you don't want the toxic gases inside mixing with the air that is distributed throughout your home. In the previous example, a faulty heat exchanger could lead to a broken down automobile, but in your home you could be gambling with your life.

Carbon Monoxide can be present in the combustion gases. It's supposed to be contained inside, but as time goes on, it becomes possible for the heat exchanger in your furnace to crack or warp. Each time your furnace turns on, the metal wall heats up and expands. During the off cycles, the metal of the heat exchanger cools and contracts. Over time this repeated process of expansion and contraction of the metal takes it's toll. The metal can become fatigued, and eventually warp out of shape, or just plain break.

As I noted before, these metal walls were designed to keep the toxic combustion gases inside the heat exchanger chamber. Guess what happens if there is a crack? That's right, the toxic gases inside can mix with the forced air that is being blown through the ductwork and into your home. Having a reliable Carbon Monoxide detector is an inexpensive measure to protect yourself and your family from the danger of Carbon Monoxide poisoning, but you can also take some proactive measures to protect against any potential danger.

Give your furnace an annual checkup, just before the heating season, to check the condition of the burners, the heat exchanger, the furnace filter, and other components that can affect the performance of your furnace. I recommend have a certified HVAC specialist do this. Only a certified specialist will have the knowledge and experience needed to know exactly what to look for, and where to look for it, as well as knowing what the operating specifications for your unit should be.

If your furnace is over 10 years old, it is even more important to keep that annual checkup. This is the time period where the years of wear and tear on your heat exchanger make a failure of the heat exchanger wall significantly more likely. Keeping your furnace in good health can also help keep you and your family in good health.

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Plate & Frame and Shell & Tube Heat Exchanger M.A.P.S Experiment

Description of the Experiment

    This experiment consists of a shell and tube and a plate and frame heat exchanger that may be operated separately.  Pneumatic control valves control the steam and water flow rates, and flowmeters record and indicate the flow of steam and water into each heat exchanger. Thermocouples measure the inlet and outlet temperature of the water and steam in each exchanger.  Temperature measurements from the thermocouples and the water flow rates are displayed on a separate display panel for each heat exchanger.

    OPTO 22 is a type of data acquisition and control software that will be used to automate the process. OPTO 22 is introduced in the Gravity-Drained tank experiment in ChE 361.  The programs required for this experiment are already set up and will be described later.
The flowmeters, thermocouples, pressure sensors, and actuators are wired into OPTO 22.  Using the appropriate program, the heat exchangers are controlled by designating flow rates or setting the desired final temperature. Two and four pass bundles with a choice of copper or stainless steel may be changed depending on the conditions of the experiment, and the number of plates on the plate and frame heat exchanger may also be changed.

Safety

Since steam is used in this experiment, safety is especially important. If the pressure exceeds 45 psi on the water side of the shell and tube, the soldered pipe joints may fail. If the steam pressure exceeds 37 psi on the plate and frame, the plate gaskets will fail.

Specific Outcomes

    The student will be provided with a unique design problem. After this lab, the student will hopefully have the following skills:
1.    Ability to specify a heat exchanger or heat exchanger system to obtain design conditions, including computer based simulations such as ASPEN.
2.    Experience with both a shell & tube and plate & frame heat exchanger-principles of operation, limitations, and approximate heat transfer coefficients.
3.    Experience with a PC-based data acquisition and control software such as OPTO 22.

Procedure

Safety   
1)    Always wear safety glasses.
2)    Familiarize with the P&ID in Figures 1 and 2.

 
Figure 1.  P&ID of MAPS Plate and Frame Heat Exchanger

 
Figure 2.  P&ID of MAPS Shell and Tube Heat Exchanger

3)    The condensate drains (valves 9 and 16) must be open at all times.
4)    Have the manual bypass valves only slightly open (valves 5,6,12 and 13) so that OPTO 22 is controlling the flow rates.
5)    Be sure the outlet temperature of the water does not exceed 85 degrees Celsius.  If this occurs at any time, shut down the steam line and let the system cool down.

Starting Up

1)    The steam lines leaving each heat exchanger have steam traps that must be cleaned before each use.  Use a pipe wrench to unscrew the large bolt on the trap and make sure that the screen is clean.  Some water may drain from the trap when it is opened.
2)    Configure the heat exchangers with the desired bundle or number of plates. (See Appendices A & B)
3)    Ensure the drain valves are open on the water and condensate lines (valves 8,9,15, and 16).
4)    Open the inlet water valve to the exchanger you are using first so that the system does not heat up right away from the steam (valve 3 for the S&T, 10 for the P&F).  
5)    After the system is ready to run (water must be flowing in the heat exchanger), turn on the steam:
1.    Ensure the main steam header is open (notify TA/Instructor if not).
2.    Open the appropriate steam valve to the heat exchanger (4 or 11)
6)   Start-up OPTO 22:
a.    Turn on the OPTO 22
b.    Open PAC Control Basic 9.0
c.    Go File -> Shell&Tube or Plate&Frame, depending on heat exchanger being used
d.    Go I/O Units -> MAPS_S_T -> PIDs -> Select Temperature_Control (for controlling the Steam valve) or Flow_Control (for controlling the Water valve)
e.    Once selected, click the Debug button.  Then click Stop Strategy and then Run Strategy.
f.    To change between control valves, click Stop Strategy, then either Temperature_Control or Flow_Control, and then Run Strategy.
g.    Open PAC Display Runtime Basic 9.0 from the desktop.
h.    Ensure that program you are using is the heat exchanger being used.  If not, go File -> Open Project -> ‘Up One Level’ button to the ‘MAPS HEX’ folder -> Open the correct heat exchanger folder -> Open Shell_Tube_HEX or Plate_Frame_HEX PAC Display Project
i.    On the opening screen, in the ‘Choose Your Control Mode’ dropdown, select the mode that your chose previously in the PAC Control Basic program.
j.    Click the graph in the bottom right to control the valve.
k.    To change between valves being controlled, exit out of PAC Display Runtime Basic 9.0 and reopen it, choosing the desired control program as shown in step h (NOTE: change the PAC Control Basic program as shown in step e before doing this).
8)    To change between heat exchangers, follow this procedure:
a.    Close the steam input valve coming from the main line to the previously used exchanger.
b.    Fully open the water input valve to the previously used exchanger for at least 5 minutes to cool down the exchanger, and then close the water input valve.
c.    Close the condensate valve coming from the previous exchanger (the valve after the steam trap).
d.    Follow the start-up procedure to start steam and water flow to the other exchanger.

Procedure

1)    Find tuning parameters that give sufficient control of the system for each valve and exchanger.
2)    Test the tuning parameters at various temperatures and observe the outlet temperatures of the steam and water.
3)    Collect data by clicking On in the Data Log box.
4)    To obtain data:
a.    For the Plate and Frame, open the Student Data folder -> Plate and Frame.
b.    Copy and Paste the flow DATA_LOG and/or temp DATA_LOG onto jump drive or email it to yourself.
c.    For the Shell and Tube, open the Student Data folder -> Shell and Tube.
d.    Copy and Paste the flow DATALOG and/or temp DATA LOG onto jump drive or email it to yourself.
e.    When done with the experiment, open the Temp DATA LOG directly in the folder and delete the data (not the headings) and save.

Shutdown

1)    Shut down the OPTO 22 software:
a.    Close out of PAC Display Runtime Basic 9.0.
b.    In PAC Control Basic, click Stop Strategy and close out.
c.    Turn off OPTO 22 device
3)    To shut down the exchanger, follow Steps 8a-b in the Starting up procedure.
4)    Have TA/Instructor close off steam header. 

Reporting

1.   
   
APPENDIX A - CHANGING A BUNDLE

To change the bundle in the shell and tube, follow these steps:
1)    Use the bundle support cart to hold the bundles. Never place them anywhere other than the crates or cart.
2)    Open the drain on the water line and let the water completely drain out of the heat exchanger.
3)    Remove the inlet and outlet lines to the heat exchanger.
4)    Remove the head of the shell with the two 7/8 inch wrenches and pull the bundle out, being sure to drain the bundle. 
5)    Obtain the proper gaskets that are needed for the new bundle:
a.    A steam gasket
b.    A two or four pass gasket
6)    Place the steam gasket on the back side of the new bundle and the water gasket on the front side.  The holes should match up.
7)    Slide the new bundle into the shell and replace the head, using the tightening pattern shown in Figure 3.  Do not tighten the bolts as far as you can the first time around the pattern.  It will take a couple of time around the crisscross pattern to correctly tighten the bolts. 
 
Figure 3.  Diagram of Shell and Tube

8)    Reconnect the tubing to the bundle from the inlet and outlet water stream, checking to make sure there are no leaks.


APPENDIX B - CHANGING THE NUMBER OF PLATES

To change the number of plates on the plate and frame follow these steps:
1)    Open the water drain and allow the heat exchanger to drain completely.
2)    Use the two 30mm wrenches to remove the nuts. 
3)    Slide the blue end plate back as far as necessary to get the plates out.  It helps to move each side a bit at a time. 
4)    To get the plates out, lean the top of the plate back and then pull it to the side and remove it.  Do this very carefully because the sides of the plates are sharp.  The first and last metal plates need to stay on the heat exchanger. 
5)    When replacing plates be sure to alternate the way that the gaskets are arranged. See the binder for a schematic showing why this is necessary and how the fluid flows in the heat exchanger. 
6)    Once the correct number of plates is installed, hold the plates vertical while another person slides the blue end plate snugly against the plates.
7)    Replace the nuts and tighten them.  The best way to tighten them is to start with a corner and the opposite corner bolt.  Then, go to the other corners and repeat.  Then tighten the 2 middle bolts at the same time.  Continue these patterns of tightening until all bolts are tight, again checking for leaks.

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Thermal Design specifications and properties of electronic components and materials (Part 2)

The modelling technics currently used have at least two different methods for creating real models for thermal design. One method uses direct geometrical/material analyses to make thermal model for components and the other method uses thermal resistor/capa-citor networks for example the DELPHI-project. Both of these methods should be possible in component level specifications.

The European co-operative project DELPHI /Rosten et al/ is an example of an activity where the responsibility of the thermal design has been attempted to be shared between the supplier of component and the end user.

The specification system for thermal specifications of electronic components and sub-systems and the applicable tests/measurement methods should cover following areas:

- Component specifications
- Interface specimens and materials (heat conducting specimens, thermally conductive insulators) and their specifications and models
- Subsystems (Printed circuit boards, units, rails)
- Heat sinks and fans.
- Material specifications (materials of components and other parts of electronics)

Some guidelines are needed for the thermal specification of PCB and subsystem level. It should be kept in mind that all relevant heat transfer mechanisms are treated, conduction, convection and radiation, when components are positioned on PCB. Monitoring the work of existing groups generating thermal models - DELPHI, SEED, JEDEC; SEMI, and standardising these different methods will be an important task for this research project and CENELEC.

REFERENCE

1. Rosten, H.I. et al. Final report to SEMITHERM XIII on the European-funded project DELPHI - the Development of libraries and physical models for an inte-grated design environment.
Thirteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium, Austin, TX, USA, 1997. Pp. 73 - 91.
2. Vinke, H. & Lasance, C.J.M. Recent achievements in the thermal characteriza¬tion of electronic devices by means of boundary condition independent compact models.
Thirteenth Annual IEEE Semiconductor-Thermal Measurement and Management Symposium, Austin, TX, USA, 1997. s. 32 - 39

1. ECONOMIC AND SOCIAL BENEFITS

A good thermal design of electronics is crucial on the reliable and safe operation of equip¬ment. The current situation makes it difficult to design electronics effectively because of the lack of standardised thermal specifications of electronic components and heat conducting materials. The ever increasing power density of electronics causes large difficulties for the designers who need more accurate and reliable information of thermal properties. The existence of standards could make it much more economical to make good thermal design.
 
2. SCIENTIFIC AND TECHNOLOGICAL OBJECTIVES

The RTD work-programme should contain the following tasks:

1. Definition of specifications of the thermal properties of electronic components

1.1 Parameters

Definition of the specific thermal parameters concerning thermal design of components, assembled printed wiring boards, materials and test methods.

1.2 Units

Units (and symbols) of the thermal parameters concerning thermal behavior and also design of components, assembled printed wiring boards and various materials shall be defined.

2. Thermal specifications of electronic components and interface parts

2.1 Evaluation of various package types of electronic components

Evaluation of package types used in electronic components shall cover such packages which probably have use also in the future. Evaluation concentrates on finding possibilities to use some simplified geometric thermal model for these package types. Therefore the project has to find and develop some principles how such simpilification should be done.

2.2. PBGA-package evaluation of simplification of detailed geometric models

The objective is to develop methodology for deciding what level of geometric simplification is practical in modelling thermal properties of Plastic ball grid array packages (PBGA). The project includes comparing the simplified models to accurate geometric model of this package type by using simulations and testing.

2.3 Resistor package geometric model

The effect of mounting method of resistors on temperature of the component itself. Developing description of some standardised mounting methods.

2.4 Description of heat sink thermal properties

Develop a method for describing thermal behaviour of heat sinks by using effective heat transfer surface area  for the component instead of using the thermal model of heat sink. This kind of scaling factor reduces the size of accurate thermal model considerably.

3. Thermal specifications of materials used in electronic components

3.1 Material types

Selection of basic material types, how to manage specification for
- construction materials
- interface materials, glues, adhesives, plates

Metals, plastics, ceramics, adhesives, glues, printed wiring board materials, other conductive materials, powder metals, composites

3.2 Basic properties of various materials

- Standard definition of various properties (use of other standards)
- Description of specification for various basic material types
- Effect of surface contact resistance on thermal properties
Thermal conductivity, thermal resistance, contact resistance at surface, thermal capacitance, specific heat, emissivity, density, coefficient of thermal expansion, surface properties (roughness), etc.

3.3. Test methods of thermal properties of materials

- Comparison and further development of test methods
- Selection of test methods to measure various material types

7. TIME SCALE

Although no rigid time scale requirements apply to this project, based on the described objectives, the whole project should be completed within three years maximum.

8. IMPORTANT ADDITIONAL INFORMATION

To get a reasonable amount of progress in this area, a minimum of three intrested parties is necessary.

Close connections with CENELEC should be demonstrated in the proposal, and ensured during the proposed workplan, in order to properly match the requirements of industry and the evolution of technology.

Thermal specifications and properties of electronic components and materials (Part 1)

1. CONFORMITY WITH THE WORK PROGRAMME

This topic falls under the Competitive and Sustainable Growth Programme, generic activity Measurement and Testing.  Specifically, it is related to Objective GROW-2000-6.2.1 Methodologies to Support Standardisation and Community Policies for which expressions of interest have been called.

2. KEYWORDS

Thermal specification, thermal design, electronic component, modelling, thermal interface, properties of materials, design rule, test method, standardisation.

3. SUMMARY OF OBJECTIVES AND JUSTIFICATION

Controlled thermal design of electronic equipment is currently a very important area of electronic design. This is because the dissipated power densities of modern electronic chips have now reached such a high level that advanced heat transfer systems are needed. However there currently exists very little standardised information about the thermal properties of various electronic components and materials, or the test methods for verify¬ing these thermal properties.

With the new standardised specifications, models and test methods the users and designers of electronic equipment could get better, compatible and more realistic description of the thermal behavior of electronic equipment. Design time reduction and better accuracy can be achieved by using more effective and harmonized thermal models and specifications of electronic components and of heat conducting materials.

4. BACKGROUND

Controlled thermal design of electronic equipment is currently a very important area of electronic design. This is because the dissipated power densities of modern electronic chips have now reached such a high level that advanced heat transfer systems are needed.
However, there currently exists very little standardised information about the thermal properties of various electronic components and materials, or the test methods for verify¬ing these thermal properties. In CENELEC there are no standards for the thermal design of electronic equipment and components.

With regard to standardisation, the technical development of thermal models for compo-nents, and thermal simulation methods are advanced enough, to be used for better

thermal specifications for electronic components. Recent studies performed in Europe by DELPHI and SEED projects (DELPHI = Development of Libraries of Physical models for an Integrated design environment, SEED = Supplier Evaluation and Exploitation of DELPHI, SEED is European ESPRIT project) and the published documents by JEDEC and SEMI will help when starting specification work at CENELEC. In the International Electrotechnical Commission (IEC) there are not any activities on this area yet.

The information sources of thermal data for the manufacturer of electronic equipment are material suppliers and component suppliers. Using both of these channels the equipment designer should get reasonable thermal data. To improve this data flow from supplier to equipment manufacturer, some standardised specification system is needed. CENELEC is the most suitable organisation to co-ordinate this task.

On the following page there is a key figure illustrating ideas on how to manage the basic thermal design specification parameters which should be addressed when specifying an elec-tronic component. In these specifications it is very important, to cover all the applicable heat transfer mechanisms: thermal conduction, convection and radiation.

It is also important to describe every component type by the actual feasible method (which is also measurable) to be used in verification of given parameter values in various models.

How to manage thermal properties of electronic components?

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Thermal Design Objective for Spacecraft

The basic purpose of thermal design is to maintain the temperature of all spacecraft components within desired limits.  We also wish to minimize the temperature fluctuation (thermal cycling) that the spacecraft components are subjected to.  FalconSat-2’s internal components, which are the most thermally sensitive parts of the satellite, are fairly thermally decoupled from the external heat flux the satellite is subjected to.  This is due to the design with the inner column and outer structural shell.  This allows us to control the temperature with a passive thermal design approach.  We will modify the thermo-optical properties (absorptivity and emissivity values) of the external facets of the satellite so that the satellite and all components are maintained within the optimal temperature range.

On FalconSat-2, the operational temperatures are limited by the electronic components within the satellite, and specifically by the battery.  The battery is the most thermally sensitive of the satellite subsystems because it cannot be recharged below 0˚C.  As a result, the nominal temperature range targeted for the batteries and internal components of FalconSat-2 is +5 to +30 deg C.  The other commercial electronics within the satellite have temperature limits of –40 and +85 deg C.  The structural components and solar panels have much more relaxed temperature limits.  Table 1 lists the temperature limits for FalconSat-2.

Table 1 – Temperature limits for FalconSat-2 subsystems

To design the thermal subsystem and ensure that FalconSat-2 will meet these temperature limits, we had to first simulate the thermal behavior of the satellite.  This will allow us to see how the satellite will behave without any thermal control implemented, which will in turn show us what design we must implement to meet the temperature range requirements.  In order to simulate the satellite’s thermal behavior, a model had to be created.

We require a detailed thermal model of FalconSat-2 for several reasons.  Primarily, we need to simulate expected on-orbit thermal behavior of the satellite and ensure that no spacecraft components exceed their maximum or minimum temperature limits.  We also need to ensure that the temperature fluctuation (thermal cycling) of all spacecraft components is minimized.  By simulating varying on-orbit scenarios, including varying attitude modes and varying subsystem operation modes, we can also simulate worst-case hot and worst-case cold temperature scenarios.  Furthermore, we wish to use the thermal model to simulate testing environments that we will subject the satellite to at various phases throughout the development.  Furthermore, we wish to integrate the thermal model into an overall behavioral model of the satellite to assess the interaction of the thermal design with the rest of the satellite.

The inputs to the flux history calculation routine are the satellite’s epoch classical orbital elements, epoch date and Universal Time, the satellite’s attitude control method (Sun-tracking, velocity tracking, tumbling, or quaternions), and the time of flight taken from the simulation clock.  The outputs are insolation, Earth infrared, and albedo fluxes for each face with respect to time for an entire orbit.

The flux history calculation model is broken into five modules within MatLab.  These modules, along with their inputs and outputs, are discussed here:

COE Update--This module updates the classical orbital elements (COEs) from the epoch time to the current simulation time. Inputs are the epoch COEs, the epoch date and time, and the time of flight, taken from the MatLab simulation clock.  This module outputs updated COEs for the satellite and the current Julian date.

Light--This module calculates the sun position vector, the satellite position and velocity vectors, and whether or not the sun currently illuminates the satellite.  Inputs are the current COEs and Julian date.  Outputs are the satellite position vector (R), satellite velocity vector (V), sun position vector (Rsun), illumination flag (Vis) and satellite/sun Beta angle.

Surface Normals--This module calculates the surface normal vectors of each of the six faces of the satellite.  This routine is used if the satellite is sun-tracking, velocity-tracking, or randomly tumbling.  There is a switch where the user can choose which tracking mode to use.  Alternatively, the surface normal vectors can be calculated using quaternions from an interface with Satellite Tool Kit.  There is a switch that allows the user to choose which method of calculating the surface normal vectors they would like to use.  Inputs are the satellite position vector (R), satellite velocity vector (V), sun position vector (Rsun), illumination flag (Vis) and satellite/sun Beta angle.  Outputs from the module are the surface normal vectors for each face of the satellite, the angle from the +K axis to the satellite R vector (phi), and the angle from the +I axis to the satellite R vector (theta).

Insolation--This module calculates the insolation flux on each of the six faces of the.  Its inputs are the surface normal vectors, sun position vector, and illumination flag.  It outputs the insolation flux on each face in Wm-2 in both graphical and matrix form.

Earth Effects--This module calculates the Earth Infrared and Albedo flux on each of the six faces of the satellite.  This part of the model takes the longest time, as there is a double discrete summation to calculate the Earth IR and Albedo view factors for each face of the satellite.  Inputs are the surface normal vectors for each face of the satellite, the satellite position vector (R), the sun position vector (Rsun), the angle from the +K axis to the satellite R vector (phi), and the angle from the +I axis to the satellite R vector (theta).  It outputs the Earth infrared and Albedo flux on each face in Wm-2 in both graphical and matrix form.

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Heat Exchanger – Why is it Important?

The technology has progressed over the past few years and many devices and equipment has been created to carry out arduous tasks. There are many types of a heat exchanger that are used in many high end industrial applications these days. While these are used for many different reasons, one of the most prominent ones includes the fact that they allow the transfer of heat and ensure seamless usage in short and the long run. With a lot of heat exchangers out there, choosing a special one is important, which is why all those who are willing to purchase one should be aware of its features beforehand. This surely calls for a lot of research before finally investing the money.

Installation & Price

Another feature of a heat exchanger that individuals should be aware of is the fact that they are of high cost usually. However, with the initial cost being high, it is completely worth it in the long run since these last for a long period of time because of the fact that they have high end durability. Since they are not deteriorated easily, it means that the initial investment being high does not matter as much – since it is a good investment in the near future. Using these heat exchangers may as well cost a lot in the first place but it definitely provides the best possible results in all applications.

Involvement in Chemical Cleaning

The best part is the fact that these exchangers can be cleaned as well, most importantly, through chemical cleaning. The process has to be done carefully, but it eventually brings out positive results in a short period of time. These exchangers are being sued by many high end industries as well as in other sectors. Therefore, those who wish to purchase these should most definitely c heck out their features in the first see in order to see what they are paying for and all the benefits they can acquire later on.

Assemblement of Heat Exchangers

Similarly, a heat exchanger is rather complex in comparison with other kinds of heat equipment. This is due to the fact that their assembly is not as easy. With a lot of connections, bolts as well as tubes to assemble, it may take up some time. However, the best part is that the disassembling is not nearly as difficult as one may expect it to be. This is what makes these exchangers the best for anyone who wishes to use them for both commercial as well as industrial uses in the long run. 

Wide Variety of Sizes & Weight

The size and weight of a heat exchanger is normally high, which is another feature of this equipment that individuals should be aware of before investing in it for good. Due to the fact that it weighs more, it is used for higher end industrial applications. With their heat transferal properties, these heat exchangers come in handy for all kinds of processes that require immediate or long-term exchange of heat. However, as their weight is more than the other sorts of heat exchangers, their installation costs will be higher as well but those are eventually covered in the long run; therefore, it is not something to worry about in the first place.

Level of Heat Efficiency

The heat efficiency of a heat exchanger is said to be rather high in comparison with all the other types of heat devices. This is both beneficial and sometimes, not as much too. However, individuals who are looking for heat exchangers that have low heat efficiency can surely go on and look for other options that are being provided in the market currently. The heat efficiency can be increased but not by a long shot, so these actually make the perfect heat equipment where less heat efficiency is required for a specific task.